AFOX DDR4 8G 2133 UDIMM memory module 8 GB 1 x 8 GB 2133 MHz

SKU

AFLD48VH1P

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£25.51 £21.26

In stock

DDR4 2133MHz, CL15, 1.2V, Unbuffered, Long DIMM, 288pin

Category: Memory Modules

Description

- JEDEC Standard
- DDR4 Speed Grade : 2133 Mbps
- Unbuffered DIMM : 288-pin
- 16 internal banks; 4 groups of 4 banks each
- Memory Organization : x8 FBGA DRAM chip
- CAS latency : CL15
- Bandwidth : 17000MB/s
- Data bus inversion (DBI) for data bus
- VDD voltage : 1.2V
- VDDQ voltage : 1.2V
- VPP voltage: 2.5V
- Serial presence detect with EEPROM
- PCB height : 1.23 inch (31.25mm)
- RoHS Compliant

More Information

SKU	AFLD48VH1P
EAN	4897033788175
Manufacturer	AFOX
In Stock	Y

Tech Specs

Power
Memory voltage	1.2 V
Design
Certification	CE
JEDEC standard	Yes
Technical details
Chips organisation	x8 FBGA DRAM chip
Country of origin	China
Compliance certificates	RoHS
Memory
Buffered memory type	Unregistered (unbuffered)
Compatible chipsets	Intel® H110
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	15
Memory voltage	1.2 V
Row cycle time	46.5 ns
Refresh row cycle time	260 ns
Row active time	33 ns
Memory channels	Dual-channel
ECC	No
Memory clock speed	2133 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Memory bandwidth (max)	17 GB/s
Features
Buffered memory type	Unregistered (unbuffered)
Compatible chipsets	Intel® H110
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	15
Memory voltage	1.2 V
Row cycle time	46.5 ns
Refresh row cycle time	260 ns
Row active time	33 ns
Memory channels	Dual-channel
Country of origin	China
Certification	CE
ECC	No
Memory clock speed	2133 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Memory bandwidth (max)	17 GB/s
JEDEC standard	Yes

Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Certificates
Certification	CE
Weight & dimensions
Package width	88 mm
Package height	168 mm
Width	133 mm
Height	31 mm
Weight	18 g
Package weight	36 g
Packaging data
Package width	88 mm
Package height	168 mm
Package weight	36 g
Other features
Chips organisation	x8 FBGA DRAM chip
Country of origin	China