AMD EPYC 7713 processor 2 GHz 256 MB L3

SKU

100-000000344

£1,219.88 £1,016.57

64 cores, 128 threads, 2.0 GHz base frequency, 3.675 GHz boost frequency, 256MB L3 cache, 225W TDP

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Processor
Processor base frequency	2 GHz
Processor manufacturer	AMD
Configurable TDP-down	225 W
Thermal Design Power (TDP)	225 W
Processor cache	256 MB
Processor model	7713
Processor threads	128
Processor boost frequency	3.675 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	64
Processor socket	Socket SP3
Configurable TDP-up	240 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	225 W
Thermal Design Power (TDP)	225 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	225 W
Market segment	Server
Configurable TDP-up	240 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	225 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	240 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2 GHz
Processor manufacturer	AMD
Configurable TDP-down	225 W
Thermal Design Power (TDP)	225 W
Processor cache	256 MB
Processor model	7713
Processor threads	128
Processor boost frequency	3.675 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	64
Processor socket	Socket SP3
Configurable TDP-up	240 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	225 W
Thermal Design Power (TDP)	225 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	225 W
Market segment	Server
Configurable TDP-up	240 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	225 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	240 W
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000344	CM8066002041900	CM8066002645900	CM8066902026904	CD8067303657201	CD8069504194301
Manufacturer	AMD	Intel	Intel	Intel	Intel	Intel
Processor lithography	N/A	up to 22nm	up to 22nm	14 nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E5 v4	Intel Xeon E5 v4	Intel Xeon E7 v4	Intel Xeon Gold	Intel Xeon Gold
Processor socket	Socket SP3	LGA 2011-v3	LGA 2011-v3	LGA 2011 (Socket R)	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	64	8	16	16	12	20
On-board graphics card	N/A	N	N	N	N	N
Discrete graphics card	N/A	N/A	N/A	N/A	N/A	N
Cooler included	N/A	N	N	N	N	N
Package type	N/A	Tray	Tray	Tray	Tray	Tray