AMD EPYC 8434P processor 2.5 GHz 128 MB L3 Tray

SKU

100-000000877

£4,888.78 £4,073.98

Socket SP6, 48 cores, 96 threads, 2.5 GHz base clock, 3.1 GHz boost clock, 128 MB cache, 200 W TDP

Note: These items come from the EU which will take 7-10 days to be delivered

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Tech Specs

Processor
Processor base frequency	2.5 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	8434P
Processor threads	96
Processor boost frequency	3.1 GHz
Processor family	AMD EPYC
Processor cores	48
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W
Packaging data
Package type	Tray

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Specifications

Processor
Processor base frequency	2.5 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	8434P
Processor threads	96
Processor boost frequency	3.1 GHz
Processor family	AMD EPYC
Processor cores	48
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W
Packaging data
Package type	Tray

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SKU	100-000000877	S26361-F4082-L217	S26361-F4082-L218	100-100000074WOF	100-100000086WOF	100-000000086
Manufacturer	AMD	Fujitsu	Fujitsu	AMD	AMD	AMD
Processor lithography	N/A	up to 22nm	up to 22nm	N/A	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon Gold	Intel Xeon Gold	N/A	AMD Ryzen Threadripper	AMD Ryzen Threadripper PRO
Processor socket	Socket SP6	LGA 3647 (Socket P)	LGA 3647 (Socket P)	N/A	N/A	N/A
Processor cores	48	8	16	N/A	32	32
On-board graphics card	N	N	N	N/A	N	N
Discrete graphics card	N	N	N	N/A	N	N
Cooler included	N	N	N	N/A	N	N
Package type	Tray	N/A	N/A	N/A	Tray	Tray