| Features |
|---|
| Trusted Platform Module (TPM) version | 2.0 |
| Trusted Platform Module (TPM) | Yes |
| Integrated BMC with IPMI | Yes |
| Harmonized System (HS) code | 8473301180 |
| Export Control Classification Number (ECCN) | 5A002U |
| Commodity Classification Automated Tracking System (CCATS) | G157815L1 |
| Embedded options available | No |
| Number of UPI links | 3 |
| Intel Node Manager | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Technical details |
|---|
| USB ports quantity | 3 |
| Packaging content | (1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K74857 (1) 1U storage module air duct right – iPN K88592 (1) 1U storage module air duct left – iPN K88590 (2) 1U riser bracket to support TNP1URISER – iPN K25206 (2) M.2 heat sink assembly TNPM2HS (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) Storage Compute Module Docking Board TNPSTDCKBRD (2) OCuLink cable 520 mm – iPN K73563 (2) OCuLink cable 125 mm – iPN K73567 (2) OCuLink cable 145 mm – iPN K73568 (2) OCuLink cable 140 mm – iPN K73570 (1 each) OCuLink connector covers for J25, J26, J29, and J30 – iPN K74231 (1 each) OCuLink connector covers for J27 and J28 – iPN K74230 |
| Number of storage drives supported | 16 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Advanced Management Technology | Yes |
| Trusted Platform Module (TPM) version | 2.0 |
| Trusted Platform Module (TPM) | Yes |
| Rack-Friendly board | Yes |
| Intel Intelligent Power Node Manager | Yes |
| Integrated BMC with IPMI | Yes |
| CPU configuration (max) | 2 |
| Chassis type | Rack (2U) |
| Target market | High Performance Computing |
| Status | Launched |
| Riser slot 2 number of lanes | 24 |
| Riser slot 1 number of lanes | 32 |
| Launch date | Q3'21 |
| Extended warranty available for purchase (select countries) | Yes |
| Expected discontinuance date | 2025 |
| Harmonized System (HS) code | 8473301180 |
| Export Control Classification Number (ECCN) | 5A002U |
| Commodity Classification Automated Tracking System (CCATS) | G157815L1 |
| Logistics data |
|---|
| Harmonized System (HS) code | 8473301180 |
| Processor special features |
|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Advanced Management Technology | Yes |
| Intel Intelligent Power Node Manager | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Processor ARK ID | 210519 |
| Design |
|---|
| Rack-Friendly board | Yes |
| Chassis type | Rack (2U) |
| Power |
|---|
| Thermal Design Power (TDP) | 205 W |
| Weight & dimensions |
|---|
| Width | 216 mm |
| Height | 82 mm |
| Depth | 591.4 mm |
| Packaging data |
|---|
| Packaging content | (1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K74857 (1) 1U storage module air duct right – iPN K88592 (1) 1U storage module air duct left – iPN K88590 (2) 1U riser bracket to support TNP1URISER – iPN K25206 (2) M.2 heat sink assembly TNPM2HS (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) Storage Compute Module Docking Board TNPSTDCKBRD (2) OCuLink cable 520 mm – iPN K73563 (2) OCuLink cable 125 mm – iPN K73567 (2) OCuLink cable 145 mm – iPN K73568 (2) OCuLink cable 140 mm – iPN K73570 (1 each) OCuLink connector covers for J25, J26, J29, and J30 – iPN K74231 (1 each) OCuLink connector covers for J27 and J28 – iPN K74230 |
| Other features |
|---|
| On-board graphics card | No |
| CPU configuration (max) | 2 |
| Target market | High Performance Computing |
| Status | Launched |
| Riser slot 2 number of lanes | 24 |
| Riser slot 1 number of lanes | 32 |
| Launch date | Q3'21 |
| Extended warranty available for purchase (select countries) | Yes |
| Expected discontinuance date | 2025 |
