Supermicro MBD-X12SCZ-QF Intel Q470 LGA 1200 (Socket H5) micro ATX

SKU

MBD-X12SCZ-QF-O

£495.38 £412.82

In stock

microATX, Single Socket LGA-1200, Up to 10 cores, Up to 128GB Unbuffered non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots, Intel Q470

Technical details
Motherboard chipset	Intel Q470
Number of processors supported	1
Number of DIMM slots	4
Motherboard form factor	micro ATX
Component for	Server
Thermal Design Power (TDP)	125 W
Performance
Motherboard chipset	Intel Q470
RAID levels	0, 1, 5, 10
Motherboard form factor	micro ATX
Component for	Server
Processor
Processor manufacturer	Intel
Thermal Design Power (TDP)	125 W
Compatible processor series	Intel® Celeron®, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9, Intel® Pentium®
Processor socket	LGA 1200 (Socket H5)
Processor number of cores supported	10
Memory
Supported memory types	DDR4-SDRAM
Memory voltage	1.2 V
Non-ECC	Yes
Supported memory clock speeds	2133,2400,2666,2933 MHz
Maximum internal memory	128 GB
Storage controllers
Supported storage drive interfaces	SATA III
RAID levels	0, 1, 5, 10
RAID support	Yes
Graphics
On-board graphics card model	Aspeed AST2500
Internal I/O
USB 3.2 Gen 2 (3.1 Gen 2) connectors	2
Supported storage drive interfaces	SATA III
USB 2.0 connectors	6
TPM connector	Yes
Number of SATA III connectors	4
Number of COM connectors	2
Rear panel I/O ports
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	8
VGA (D-Sub) ports quantity	1
Ethernet LAN (RJ-45) ports	2
DVI-D ports quantity	1
DisplayPorts quantity	2

Network
Ethernet LAN	Yes
LAN controller	Intel® I210-AT, Intel® I219-LM
Ethernet interface type	Gigabit Ethernet
Features
Motherboard chipset	Intel Q470
Motherboard form factor	micro ATX
Component for	Server
Harmonized System (HS) code	84733020
Expansion slots
PCI Express x16 (Gen 3.x) slots	1
BIOS
BIOS type	UEFI AMI
ACPI version	6.1
System Management BIOS (SMBIOS) version	3.1
Operational conditions
Storage temperature (T-T)	-40 - 85 °C
Operating temperature (T-T)	0 - 60 °C
Storage relative humidity (H-H)	5 - 95%
Operating relative humidity (H-H)	10 - 85%
Logistics data
Harmonized System (HS) code	84733020
Weight & dimensions
Width	243.8 mm
Depth	243.8 mm
Other features
Thermal Design Power (TDP)	125 W
Number of processors supported	1
Number of DIMM slots	4
Supported DIMM module capacities	4GB, 8GB, 16GB, 32GB