AMD EPYC 7313 processor 3 GHz 128 MB L3 Tray

SKU

100-000000329

£439.15 £365.96

16 cores, 32 threads, 3GHz base clock, 3.7GHz boost clock, 128MB L3 cache, 155W TDP

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Tech Specs

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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Specifications

Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7313
Processor threads	32
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	16
Processor socket	Socket SP3
Configurable TDP-up	180 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	155 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Configurable TDP-up	180 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	180 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000329	BX80634E52430V2	CM8064601560113	CM8064401575702	CM8066201920103	CM8066002032201
Manufacturer	AMD	Intel	Intel	Intel	Intel	Intel
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	14 nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E5 v2	Intel Core i7	Intel Xeon E5 v3	Intel Core i7	Intel Xeon E5 v4
Processor socket	Socket SP3	LGA 1356 (Socket B2)	LGA 1150 (Socket H3)	LGA 2011-v3	LGA 1151 (Socket H4)	LGA 2011-v3
Processor cores	16	6	4	12	4	8
On-board graphics card	N	N	Y	N	Y	N
Discrete graphics card	N	N/A	N/A	N/A	N/A	N/A
Cooler included	N	N/A	N	N	N	N
Package type	Tray	Box	Tray	Tray	Tray	Tray