AMD EPYC 7443 processor 2.85 GHz 128 MB L3

SKU

100-000000340

£951.60 £793.00

24 cores, 48 threads, 2.85 GHz base frequency, 4.0 GHz boost frequency, 128MB L3 cache, 200W TDP

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Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443
Processor threads	48
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443
Processor threads	48
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000340	CM8066902026904	CD8067303561400	CD8069504194301	4XG7A14812	P02571-B21
Manufacturer	AMD	Intel	Intel	Intel	Lenovo	HPE
Processor lithography	N/A	14 nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E7 v4	Intel Xeon Silver	Intel Xeon Gold	Intel Xeon Silver	Intel Xeon Silver
Processor socket	Socket SP3	LGA 2011 (Socket R)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	24	16	8	20	8	8
On-board graphics card	N/A	N	N	N	N	N
Discrete graphics card	N/A	N/A	N/A	N	N	N
Cooler included	N/A	N	N	N	N/A	N
Package type	N/A	Tray	Tray	Tray	N/A	N/A