AMD EPYC 7532 processor 2.4 GHz 256 MB L3 Tray

SKU

100-000000136

£670.12 £558.43

AMD EPYC 7532, 2.4 GHz, 32 CPU Core, L3 256 MB, SP3, TDP 200W, Tray

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Tech Specs

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	200 W
Processor cache	256 MB
Processor model	7532
Processor threads	64
Processor operating modes	64-bit
Processor boost frequency	3.3 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

AMD Infinity Architecture

With architecture, performance, and security leadership, our approach to processor design accelerates the pace of innovation so that you can break through years of data center stagnation.

Specifications

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	200 W
Processor cache	256 MB
Processor model	7532
Processor threads	64
Processor operating modes	64-bit
Processor boost frequency	3.3 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	200 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000136	CM8064401575702	CD8067303561400	P02571-B21	100-000000076	100-000000043
Manufacturer	AMD	Intel	Intel	HPE	AMD	AMD
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E5 v3	Intel Xeon Silver	Intel Xeon Silver	AMD EPYC	AMD EPYC
Processor socket	Socket SP3	LGA 2011-v3	LGA 3647 (Socket P)	LGA 3647 (Socket P)	Socket SP3	Socket SP3
Processor cores	32	12	8	8	48	16
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N/A	N/A	N	N	N
Cooler included	N	N	N	N	N	N
Package type	Tray	Tray	Tray	N/A	Tray	Tray