AMD EPYC 7F32 processor 3.7 GHz 128 MB L3

SKU

100-000000139

£897.55 £747.96

AMD EPYC 7F32, 3.7 GHz, 8 CPU Core, L3 128 MB, SP3, TDP 180W, Tray

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Tech Specs

Processor
Processor base frequency	3.7 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7F32
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available

Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

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Specifications

Processor
Processor base frequency	3.7 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7F32
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available

Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000139	CM8066902026904	4XG7A14812	P02571-B21	P02494-B21	CD8069504283304
Manufacturer	AMD	Intel	Lenovo	HPE	HPE	Intel
Processor lithography	N/A	14 nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E7 v4	Intel Xeon Silver	Intel Xeon Silver	Intel Xeon Silver	Intel Xeon Gold
Processor socket	Socket SP3	LGA 2011 (Socket R)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	8	16	8	8	8	8
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N/A	N	N	N	N
Cooler included	N	N	N/A	N	N	N
Package type	N/A	Tray	N/A	N/A	N/A	Tray