AMD EPYC 8024P processor 2.4 GHz 32 MB L3 Tray

SKU

100-000001136

£704.60 £587.17

Socket SP6, 8 cores, 16 threads, 2.4 GHz base clock, 3 GHz boost clock, 32 MB cache, 90 W TDP

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Tech Specs

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W
Processor cache	32 MB
Processor model	8024P
Processor threads	16
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP6
Configurable TDP-up	100 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W

Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	90 W
Market segment	Server
Configurable TDP-up	100 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	90 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	100 W
Packaging data
Package type	Tray

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Specifications

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W
Processor cache	32 MB
Processor model	8024P
Processor threads	16
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	8
Processor socket	Socket SP6
Configurable TDP-up	100 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W

Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	90 W
Market segment	Server
Configurable TDP-up	100 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	90 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	100 W
Packaging data
Package type	Tray

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SKU	100-000001136	CD8067303561400	P02571-B21	P02494-B21	100-000000076	100-000000043
Manufacturer	AMD	Intel	HPE	HPE	AMD	AMD
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon Silver	Intel Xeon Silver	Intel Xeon Silver	AMD EPYC	AMD EPYC
Processor socket	Socket SP6	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	Socket SP3	Socket SP3
Processor cores	8	8	8	8	48	16
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N/A	N	N	N	N
Cooler included	N	N	N	N	N	N
Package type	Tray	Tray	N/A	N/A	Tray	Tray