AMD EPYC 7573X processor 2.8 GHz 768 MB L3 Tray

SKU

100-000000506

£1,812.37 £1,510.31

Socket SP3, 32 cores, 64 threads, 2.8 GHz base clock, 3.6 GHz boost clock, 768 MB L3 cache

Note: These items come from the EU which will take 7-10 days to be delivered

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Tech Specs

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	225 W
Thermal Design Power (TDP)	280 W
Processor cache	768 MB
Processor model	7573X
Processor threads	64
Processor boost frequency	3.6 GHz
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Configurable TDP-up	280 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	225 W
Thermal Design Power (TDP)	280 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	280 W
Market segment	Server
Configurable TDP-up	280 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	280 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	280 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

Description

AMD Infinity Guard
Help minimize potential attack surfaces as software is booted, executed, and processes your critical data

AMD Infinity Architecture
Experience unified intelligence.

Specifications

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	225 W
Thermal Design Power (TDP)	280 W
Processor cache	768 MB
Processor model	7573X
Processor threads	64
Processor boost frequency	3.6 GHz
Processor family	AMD EPYC
Processor cores	32
Processor socket	Socket SP3
Configurable TDP-up	280 W
Processor cache type	L3
Package type	Tray
Memory
Memory types supported by processor	DDR4-SDRAM
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	225 W
Thermal Design Power (TDP)	280 W

Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	280 W
Market segment	Server
Configurable TDP-up	280 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	280 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	280 W
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	85423119

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SKU	100-000000506	CM8066002041900	CM8066002041500	CM8066002645900	CD8067303657201	CD8069504152900
Manufacturer	AMD	Intel	Intel	Intel	Intel	Intel
Processor lithography	N/A	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E5 v4	Intel Xeon E5 v4	Intel Xeon E5 v4	Intel Xeon Gold	Intel Xeon W
Processor socket	Socket SP3	LGA 2011-v3	LGA 2011-v3	LGA 2011-v3	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	32	8	6	16	12	16
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N/A	N/A	N/A	N/A	N
Cooler included	N	N	N	N	N	N
Package type	Tray	Tray	Tray	Tray	Tray	Tray