Supermicro AMD EPYC 7443P processor 2.85 GHz 128 MB L3

SKU

PSE-MLN7443P-0342

£1,616.80 £1,347.33

AMD EPYC 7443P, 2.85 GHz, 24C, 128 MB L3, DDR4 3200 MHz, 200W TDP

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Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Cooler included	No
Memory bandwidth supported by processor (max)	204.8 GB/s
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443P
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	4 GHz
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory bandwidth supported by processor (max)	204.8 GB/s
Memory channels	Octa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available

Power
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server

Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Cooler included	No
Memory bandwidth supported by processor (max)	204.8 GB/s
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443P
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	4 GHz
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory bandwidth supported by processor (max)	204.8 GB/s
Memory channels	Octa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available

Power
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server

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SKU	PSE-MLN7443P-0342	CM8066002041900	CM8066002041500	CM8066002645900	CD8067303657201	4XG7A14812
Manufacturer	Supermicro	Intel	Intel	Intel	Intel	Lenovo
Processor lithography	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	AMD EPYC	Intel Xeon E5 v4	Intel Xeon E5 v4	Intel Xeon E5 v4	Intel Xeon Gold	Intel Xeon Silver
Processor socket	Socket SP3	LGA 2011-v3	LGA 2011-v3	LGA 2011-v3	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	24	8	6	16	12	8
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N/A	N/A	N/A	N/A	N
Cooler included	N	N	N	N	N	N/A
Package type	N/A	Tray	Tray	Tray	Tray	N/A